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Bga rework station rw-360C solder desoldering xbox PS3
On-sale : BGA Rework Station RW SP-360C
if you need read the english manual at 1st ,pls contact us
1. BGA rework station RW SP-360C-1 PCS
* Nozzles -5 pcs (44, 41, 38, 31, 26 mm, 1pc for each size)
* Inside the hexangular wrench -1 set
* Clamp for Motherbord-1 set
* Aluminium plate for BGA IC reballing -1 pcs
* Thermo sensor wire(High precision) -1 pcs
* Reballing stencils holder -1 pcs
* Reballing stencils -33 pcs
* 0.5 /0.6/0.76mm leaded solder balls-3 bottles (1 bottle for each size , 250k/bottle)
Machine Dimension 650*500*600mm
Power supply AC 220V 4KW ( 110V is optional)
Machine Weight 36KG (Net weight)
Made of high quality heating material; desoldering and soldering procedures of BGA are precisely controlled
Movable heating head, which is able to move freely horizontally, easy to operated;
Embedded industrial computer, PLC control, real-time profile display, able to display set profile and practically-tested profile; big size screen, easy to operate;
Profile saving no limit in this industrial computer, can analyze the two practically-tested profiles, can input both English and Chinese;
The temperatures of the upper and lower hot air heaters can be precisely controlled according to their specific temperatures. The infrared constant temperature heating zone at the bottom area and the appropriate temperature-control settings make the rework safer and more reliable.
The supports for the BGA soldering supporting frame are micro-adjustable to restrain local sinkage.
Powerful cross flow fans cool the lower heating area rapidly;
The adjustable PCB positioning support, onto which the special fixtures for alloyed board could be installed, enables easy and fast positioning of the PCB board;
Buzz after soldering is finished or desoldering; Hand vacuum pen is adjustable for removing BGA;
Both the upper and lower parts are equipped with over-temperature alarming and protection apparatus.
With different alloy hot gas nozzles, easy to replace. It could be tailored as per the specific requirements.
The integrated design of machine and chassis is room-saving. could be altered to instrument-control.
The software can be updated to auto-profile in future by USB, no need to set profiles.
