Wisconsin Parts Database Instructions and Discussion Team/Group > ILLINOIS
> Machine Parts
> Add
> New
> Bga ic adhesive remover for motherboard & phone rework
Bga ic adhesive remover for motherboard & phone rework
On-sale : BGA IC Adhesive Remover for motherboard & mobile phone rework
BGA IC Adhesive Remover for motherboard and mobile phone rework ,30ml -1 pcs
* BGA IC Adhesive removing liquid softens and removes resinating and sealing glue of chip BGA IC of mobile phones.
* The ingredients of it is environmental protection and safest. It has good permeability;
* It can quickly soften and loosens solidified resin adhesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon.
* It does not to harm to circuit board and component, even to maintenance worker.
