Wisconsin Parts Database Instructions and Discussion Team/Group > WISCONSIN
> Mei 1204W hybrid wedge wire bonder
Mei 1204W hybrid wedge wire bonder
MEI 1204W Hybrid Wedge Wire Bonder Used
Model/Part No:1204W Our Item ID: 5951
Includes: (1) MEI1204W bonder with accessories as pictured.
MEI 1204W Hybrid Wedge Wire Bonder Ultrasonic bonding process using aluminum wire, thermocompression or thermosonic wire bonding using gold wire.
The MEI-1204W and MEI-907 are wire bonders designed for ultrasonic, thermosonic, or thermocompression wedge bonding of IC's, hybrids, microwave devices, and laser diodes using gold or aluminum wire from .5 mil (12.5 microns) to 3 mil (76 microns) and ribbon.
Item Tested?: Not TestedPhysical Condition: Good; Working Condition: Not Tested, or Unable To Test90 | 30x 30x30 | 1
